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March 1999
FDC6323L Integrated Load Switch
General Description
These Integrated Load Switches are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance and provide superior switching performance. These devices are particularly suited for low voltage high side load switch application where low conduction loss and ease of driving are needed.
Features
VDROP=0.2V @ VIN=5V, IL=1A, VON/OFF= 1.5V to 8V VDROP=0.3V @ VIN=3.3V, IL=1A, VON/OFF= 1.5V to 8V. High density cell design for extremely low on-resistance. VON/OFF Zener protection for ESD ruggedness. >6KV Human Body Model. SuperSOTTM-6 package design using copper lead frame for superior thermal and electrical capabilities.
SOT-23
SuperSOTTM-6
SuperSOTTM-8
SO-8
SOT-223
SOIC-16
V in,R1
4
Q2
3
Vout,C1
EQUIVALENT CIRCUIT
O N / O FF
5
Q1
2
Vout,C1
IN
+
V DROP
-
OUT
pin 1
R1,C1
6
See Application Circuit
1
O N / O FF
R2
SuperSOT TM-6
Absolute Maximum Ratings
Symbol Parameter
TA = 25C unless otherwise noted
FDC6323L
Units
VIN VON/OFF IL
Input Voltage Range On/Off Voltage Range Load Current @ VDROP=0.5V - Continuous - Pulsed
(Note 1) (Note 1 & 3) (Note 2a)
3-8 1.5 - 8 1.5 2.5 0.7 -55 to 150 6
V V A
PD TJ,TSTG ESD
Maximum Power Dissipation Operating and Storage Temperature Range
W C kV
Electrostatic Discharge Rating MIL-STD-883D Human Body Model (100pf/1500Ohm)
THERMAL CHARACTERISTICS
RJA RJC
Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case
(Note 2a) (Note 2)
180 60
C/W C/W
(c) 1999 Fairchild Semiconductor Corporation
FDC6323L Rev.F
Electrical Characteristics (T
Symbol Parameter OFF CHARACTERISTICS
A
= 25C unless otherwise noted)
Conditions
Min
Typ
Max
Units
IFL IRL VIN VON/OFF VDROP IL
Forward Leakage Current Reverse Leakage Current
VIN = 8 V, VON/OFF = 0 V VIN = -8 V, VON/OFF = 0 V 3 1.5 VIN = 5 V, VON/OFF = 3.3 V VIN = 3.3 V, VON/OFF = 3.3 V VDROP = 0.2 V, VIN = 5 V, VON/OFF = 3.3 V VDROP = 0.3 V, VIN = 3.3 V, VON/OFF = 3.3 V 1 1 0.145 0.178
1 -1
A A
ON CHARACTERISTICS (Note 3)
Input Voltage On/Off Voltage Conduction Voltage Drop @ 1A
8 8 0.2 0.3
V V V
Load Current
A
Notes: 1. VIN=8V, VON/OFF=8V, VDROP=0.5V, TA=25oC 2. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RCA is determined by the user's board design.
PD(t) =
TJ -T A R J A(t)
=
TJ -T A +R R J C CA(t)
= I 2 (t) x RDS(ON)@ J T D
Typical RJA for single device operation using the board layouts shown below on FR-4 PCB in a still air environment: a. 180oC/W when mounted on a 2oz minimum copper pad.
2a
Scale 1 : 1 on letter size paper 3. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0%
FDC6323L Rev.F
Typical Electrical Characteristics (TA = 25 OC unless otherwise noted )
0.5
T = 125C J
0.5
T = 125C J
0.4
T = 25C J
0.4
T = 25C J
V DROP (V)
0.3
VDROP (V)
0.3
0.2
V IN = 5V VON/OFF = 1.5 - 8V PW =300us, D 2%
0.2
V IN = 3.3V VON/OFF = 1.5 - 8V PW =300us, D 2%
0.1
0.1
0
0
1
2 I L (A)
3
4
0 0 1 2 I L (A) 3 4
Figure 1. VDROP Versus IL at VIN=5V.
Figure 2. VDROP Versus IL at VIN=3.3V.
1
I L = 1A VON/OFF = 1.5 - 8V PW =300us, D 2%
0.4 0.35 R (ON) ,(Ohm) 0.3 0.25 0.2 0.15
T = 25C J
0.8 V DROP (V)
I L = 1A V IN = 3.3V PW =300us, D 2%
0.6
T = 125C J
T = 125C J
0.4
T = 25C J
0.2
0
1
2
3 V IN (V)
4
5
0.1 0 1 2 I L ,(A) 3 4 5
Figure 3. VDROP Versus VIN at IL=1A.
Figure 4. R(ON) Versus IL at VIN=3.3V.
1
I L = 1A VON/OFF = 1.5 - 8V PW =300us, D 2%
0.8 R (ON) ,(Ohm)
0.6
0.4
T = 125C J
0.2
T = 25C J
0
1
2
3 V IN ,(V)
4
5
Figure 5. On Resistance Variation with Input Voltage.
FDC6323L Rev.F
Typical Electrical Characteristics (TA = 25 OC unless otherwise noted )
50
50
Vin = 3.3V IL = 1A Von/off = 3.3V R1 = 20K Ci = 10 F Co = 1 F
40 Time ( s)
td(off)
Time ( s)
40
30
30
tf
20
Vin = 5V IL = 1A Von/off = 3.3V R1 = 20K Ci = 10 F Co = 1 F
td(off)
20
tf
10
tr td(on)
4 R2 (K ) 6 8 10
10
tr td(on)
0
0
2
0
0
2
4 R2 (K )
6
8
10
Figure 6. Switching Variation with R2 at Vin=5V and R1=20KOhm.
Figure 7. Switching Variation with R2 at Vin=3.3V and R1=20KOhm.
50
250
Vin = 2.5V IL = 1A Von/off = 3.3V R1 = 20K Ci = 10 F Co = 1 F
Vin = 5V
% of Current Overshoot 200
40 Time ( s)
IL = 1A Von/off = 3.3V R1 = 20K Ci = 10 F Co = 1 F
30
150
tr
20
tf td(off) td(on)
100
3.3V
50
10
2.5V
0
0 0 2 4 R2 (K ) 6 8 10
0
2
4 R2 (K )
6
8
10
Figure 8. Switching Variation with R2 at Vin=2.5V and R1=20KOhm.
Figure 9. % of Current Overshoot Variation with Vin and R2.
500
IL = 1A Von/off = 3.3V 400 R1 = 20K Ci = 10 F Co = 1 F
t on t d(on)
Vin = 2.5V 3.3V 5V
t off tr
90%
t d(off)
90%
tf
Vdrop (mV)
300
VOUT
10%
10%
INVERTED
200
90%
100
V IN
0 20 40 R2 (K ) 60 80 100
50% 10% PULSE W IDTH
50%
0
Figure 10. Vdrop Variation with Vin and R2.
Figure 11. Switching Waveforms.
FDC6323L Rev.F
Typical Electrical Characteristics (TA = 25 OC unless otherwise noted )
10 3 1 0.3 0.1 0.03 0.01 0.1
O R( N)
10 0u s
LIM IT
IL , DRAIN CURRENT (A)
10
1m s ms
10 0m s
1s
VIN = 5V SINGLE PULSE RJA = See Note 2a TA = 25C
0.2 0.5 1 2 V DROP (V)
DC
5
10
20
30
Figure 12. Safe Operating Area.
1 TRANSIENT THERMAL RESISTANCE
r(t), NORMALIZED EFFECTIVE
0.5 0.2 0.1 0.05 0.02 0.01 0.005 0.00001
D = 0.5
0.2 0.1 0.05 0.02 0.01 Single Pulse P(pk)
RJA (t) = r(t) * R JA R JA = See Note 2a
t1
t2
TJ - TA = P * R JA(t) Duty Cycle, D = t 1/ t 2
0.001 0.01 0.1 t 1, TIME (sec) 1 10 100 300
0.0001
Figure 13. Transient Thermal Response Curve.
Note: Thermal characterization performed on the conditions described in Note 2a. Transient thermal response will change depends on the circuit board design.
FDC6323L Rev.F
FDC6323L Load Switch Application
APPLICATION CIRCUIT Q2
IN
R1 C1
OUT
General Description This device is particularly suited for compact computer peripheral switching applications where 8V input and 1A output current capability are needed. This load switch integrates a small N-Channel Power MOSFET (Q1) which drives a large P-Channel Power MOSFET (Q2) in one tiny SuperSOTTM-6 package. A load switch is usually configured for high side switching so that the load can be isolated from the active power source. A P-Channel Power MOSFET, because it does not require its drive voltage above the input voltage, is usually more cost effective than using an N-Channel device in this particular application. A large P-Channel Power MOSFET minimizes voltage drop. By using a small N-Channel device the driving stage is simplified.
O N / O FF
Q1
Co
LOAD
R2
Component Values R1 Typical 10k - 1M R2 Typical 0 - 100k (optional) C1 Typical 1000pF (optional) Design Notes R1 is needed to turn off Q2. R2 can be used to soft start the switch in case the output capacitance Co is small. R2 should be at least 10 times smaller than R1 to guarantee Q1 turns on. By using R1 and R2 a certain amount of current is lost from the input. This bias current loss is given by the equation when the switch is ON. IBIAS_LOSS can be minimized by selecting a large I BIAS_LOSS = R 1Vin +R2 value for R1. R2 and CRSS of Q2 make ramp for slow turn on. If excessive overshoot current occurs due to fast turn on, additional capacitance C1 can be added externally to slow down the turn on.
FDC6323L Rev.F
SuperSOTTM-6 Tape and Reel Data and Package Dimensions
SSOT-6 Packaging Configuration: Figure 1.0
Customize Label
Antistatic Cover Tape
Conductive Embossed Carrier Tape
F63TNR Label
631
SSOT-6 Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel (kg) Note/Comments Standard (no flow code) TNR 3,000 7" Dia 184x187x47 9,000 0.0158 0.1440 D87Z TNR 10,000 13" 343x343x64 20,000 0.0158 0.4700
631
631
631
Pin 1
SSOT-6 Unit Orientation
343mm x 342mm x 64mm Intermediate box for D87Z Option
F63TNR Label
F63TNR Label
F63TNR Label sample 184mm x 184mm x 47mm Pizza Box for Standard Option F63TNR Label
LOT: CBVK741B019 FSID: FDC633N QTY: 3000 SPEC:
Trailer SSOT-6 Tape Leader Configuration: Figure 2.0
D/C1: D9842 D/C2:
QTY1: QTY2:
SPEC REV: CPN:
QARV: (F63TNR)2
Carrier Tape Cover Tape
Trailer Tape 160mm minimum
Components
Leader Tape 390mm minimum
(c) 1998 Fairchild Semiconductor Corporation
December 1998, Rev. B
SuperSOTTM-6 Tape and Reel Data and Package Dimensions, continued
SSOT-6 Embossed Carrier Tape Configuration: Figure 3.0
T E1
P0
D0
F K0 Wc B0 E2 W
Tc A0 P1 D1
User Direction of Feed
Dimensions are in millimeter Pkg type SSOT-6 (8mm)
A0
3.23 +/-0.10
B0
3.18 +/-0.10
W
8.0 +/-0.3
D0
1.55 +/-0.05
D1
1.00 +/-0.125
E1
1.75 +/-0.10
E2
6.25 min
F
3.50 +/-0.05
P1
4.0 +/-0.1
P0
4.0 +/-0.1
K0
1.37 +/-0.10
T
0.255 +/-0.150
Wc
5.2 +/-0.3
Tc
0.06 +/-0.02
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C).
20 deg maximum Typical component cavity center line
0.5mm maximum
B0 20 deg maximum component rotation
0.5mm maximum
Sketch A (Side or Front Sectional View)
Component Rotation
A0 Sketch B (Top View)
Typical component center line
Sketch C (Top View)
Component lateral movement
SSOT-6 Reel Configuration: Figure 4.0
Component Rotation
W1 Measured at Hub
Dim A Max
Dim A max
Dim N
See detail AA
7" Diameter Option
B Min Dim C See detail AA W3
Dim D min
13" Diameter Option
W2 max Measured at Hub DETAIL AA
Dimensions are in inches and millimeters
Tape Size
8mm
Reel Option
7" Dia
Dim A
7.00 177.8 13.00 330
Dim B
0.059 1.5 0.059 1.5
Dim C
512 +0.020/-0.008 13 +0.5/-0.2 512 +0.020/-0.008 13 +0.5/-0.2
Dim D
0.795 20.2 0.795 20.2
Dim N
2.165 55 4.00 100
Dim W1
0.331 +0.059/-0.000 8.4 +1.5/0 0.331 +0.059/-0.000 8.4 +1.5/0
Dim W2
0.567 14.4 0.567 14.4
Dim W3 (LSL-USL)
0.311 - 0.429 7.9 - 10.9 0.311 - 0.429 7.9 - 10.9
8mm
13" Dia
December 1998, Rev. B
SuperSOTTM-6 Tape and Reel Data and Package Dimensions, continued
SuperSOTTM-6 (FS PKG Code 31, 33)
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in: inches [millimeters]
Part Weight per unit (gram): 0.0158
(c) 1998 Fairchild Semiconductor Corporation
September 1998, Rev. A
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM CoolFETTM CROSSVOLTTM E2CMOSTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM GTOTM HiSeCTM
DISCLAIMER
ISOPLANARTM MICROWIRETM POPTM PowerTrenchTM QSTM Quiet SeriesTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 TinyLogicTM
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.

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